Heterojunction bipolar transistor

ABSTRACT

The present disclosure is directed to a method that includes exposing a surface of a silicon substrate in a first region between first and second isolation trenches, etching the silicon substrate in the first region to form a recess between the first and second isolation trenches,=; and forming a base of a heterojunction bipolar transistor by selective epitaxial growth of a film comprising SiGe in the recess.

BACKGROUND

1. Technical Field

The present disclosure relates to a heterojunction bipolar transistor,and to a method of forming the same.

2. Description of the Related Art

For high frequency applications, bipolar transistors, and in particularheterojunction bipolar transistors (HBT), often provide a preferredsolution. It is known to integrate heterojunction bipolar transistorswith standard complementary metal oxide semiconductor CMOS processes,such that one or more HBTs can be implemented in a CMOS process withrelatively few additional photolithography masks.

However, in advanced CMOS technologies, such as 28 nm or beyond,integration of heterojunction bipolar transistors becomes much morechallenging due to constraints such as the limitation in the permittedheight of the device, which is generally incompatible with known HBTstructures, or leads to a complex and costly process.

BRIEF SUMMARY

The present disclosure is directed to an improved heterojunction bipolartransistor and method of forming a heterojunction bipolar transistorpermitting integration with advanced CMOS technologies.

According to one aspect, there is provided a method comprising: exposingthe surface of a silicon substrate in a first region between first andsecond isolation trenches; etching the silicon substrate in the firstregion to form a recess between the first and second isolation trenches;and forming a base of a heterojunction bipolar transistor by selectiveepitaxial growth of a film comprising SiGe in the recess.

According to an embodiment, the bottom of the recess is between 20 and80 nm below of the surface of the silicon substrate.

According to an embodiment, the bottom of the recess is between 50 and70 nm below of the surface of the silicon substrate.

According to an embodiment, forming the base comprises growing the filmin the recess up to a level lower than or flush with the surface of thesilicon substrate.

According to an embodiment, the method further comprises forming anemitter of the bipolar transistor by depositing an emitter material inthe first region over the base.

According to an embodiment, the method further comprises, prior toforming the base: forming the first and second isolation trenches in thesilicon substrate, and a third isolation trench such that the secondisolation trench is in between and spaced apart from the first and thirdisolation trenches; depositing one or more layers over the siliconsubstrate; and etching an opening in the one or more layers to exposethe substrate in the first region between the first and second isolationtrenches, wherein the opening partially exposes a top surface of each ofthe first and second isolation trenches.

According to an embodiment, the third isolation trench is less deep thanthe first and second isolation trenches.

According to an embodiment, the method further comprises aphotolithography step for patterning the one or more layers to form agate stack of at least one MOS transistor.

According to an embodiment, the method further comprises, prior toforming the base, forming by ion implantation a buried collector of thebipolar transistor at a level in the silicon substrate below the base.

According to another aspect, there is provided a heterojunction bipolartransistor comprising a base region comprising SiGe formed in a recessin a silicon substrate between first and second isolation trenches.

According to an embodiment, the recess is between 20 and 80 nm in depth.

According to an embodiment, the recess is between 50 and 70 nm in depth.

According to an embodiment, the transistor further comprises an emitterformed directly over the base.

According to another aspect, there is provided an integrated circuitcomprising: the above heterojunction bipolar transistor; and at leastone MOS transistor.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The foregoing and other features and advantages will become apparentfrom the following detailed description of embodiments, given by way ofillustration and not limitation with reference to the accompanyingdrawings, in which:

FIG. 1 is a cross-section view of a known integrated circuit comprisinga bipolar transistor;

FIG. 2 is a cross-section view of a portion of an integrated circuitcomprising a heterojunction bipolar transistor according to an exampleembodiment of the present disclosure; and

FIGS. 3A to 3I are cross-section views of an integrated circuit atvarious stages during formation of a heterojunction bipolar transistoraccording to an example embodiment of the present disclosure.

As is normal in the case of drawings of semiconductor structures, thevarious figures are not drawn to scale.

DETAILED DESCRIPTION

FIG. 1 is a cross-section view reproducing FIG. 19 of U.S. PatentApplication Publication No. 2011/0057266.

As illustrated on the left hand side in FIG. 1, a semiconductorsubstrate includes a bipolar transistor having a subcollector region 32connected with a collector contact via a subcollector feedthrough 31,and formed under a collector region 30. An epitaxial base 60A is formedextending up from the surface of the semiconductor substrate, over thecollector 30. An emitter 70 is formed extending up from the base 60A,and a polycrystalline extrinsic base portion 60B is also formed over thebase 60A on each side of the emitter 70.

As illustrated on the right hand side in FIG. 1, a pair of CMOS devicesare also formed, each having a gate stack 50 comprising a dielectricmaterial layer 40, a metal layer 42, semiconductor material layers 44and 46, and a gate metal-semiconductor alloy region 89.

While the structure of FIG. 1 provides an example of a bipolartransistor having an epitaxial base integrated with a CMOS process, onedrawback of this solution is the overall height of the bipolar device.Indeed, the epitaxial base 60A and emitter 70 are stacked above thesemiconductor substrate, leading to a relatively high device. Anotherdrawback of the structure of FIG. 1 is that it is very complex tofabricate.

FIG. 2 is a cross-section view of an integrated circuit 200 comprising aheterojunction bipolar transistor according to an embodiment of thepresent disclosure.

A semiconductor substrate 202, for example formed of p-type silicon, hasshallow trench isolations (STIs) 204 and 206 delimiting the bipolardevice on each side, and an STI 208 positioned between the STIs 204 and206. The isolation trenches are trenches filled with a dielectricmaterial, for example silicon dioxide. A buried collector region 212 ispositioned between the STIs 204 and 208, having a top level at a depthof between 20 and 80 nm below the surface 213 of the silicon substrate,and a bottom level of between 200 and 300 nm below the surface 213 ofthe silicon substrate. For example the collector 212 has a thickness ofbetween 150 and 250 nm. The STI 208 separates the base of the devicefrom a collector contact region 214, which for example extends to adepth of between 30 and 150 nm from the surface 213 of the siliconsubstrate. The STIs 204, 206 and 208 for example all extend to a depthof between 150 and 300 nm from the surface 213 of the silicon substrate,for example around 250 nm. As shown by a dashed line 210 in FIG. 2, insome embodiments the STI 208 can be shallower than the STIs 204 and 206,for example extending to a depth of between 50 and 150 nm, such that ashorter conduction path is provided between the collector contact region214 and the portion of the collector formed under the base of thebipolar transistor.

An at least partially buried base 216 is formed by an epitaxial filmcomprising SiGe, for example formed of SiGeC, although other materialsmay be used. Optionally, the base 216 comprises a capping layer of Si.The buried base for example extends from the surface 213 of the siliconsubstrate into the substrate to a depth of between 20 and 80 nm, forexample between 50 and 70 nm. The base width, which corresponds to thedistance between the STIs 204 and 208, is for example between 200 and300 nm.

An emitter of the HBT comprises a zone 218 extending a short way intothe base film 216, and an emitter 220 forming a stack 221 over a regionof the base 216. The zone 218 for example corresponds to a zone in whichdoping ions, for example of n-type, have migrated from the emitter 220into the base film 216 through an opening formed in a hard mask layer219A, 219B present at the bottom of the emitter 220. The width of thisopening is for example between 40 and 80 nm. The width of the emitter220 is for example between 80 and 200 nm.

The emitter stack 221 for example has a first layer of spacers 222 and asecond layer of spacers 224 formed on each side. The total width of thespacers on each side of the stack 221 is for example between 10 and 20nm.

Below the spacers 222, 224 on each side of the emitter stack 221 anextrinsic base 226 is for example provided. Furthermore, between theedges of the spacers and the STIs 204 and 208 on each side of theemitter stack 221, metal silicide layers 228 and 230 are present formaking contact with the base. Furthermore, a silicide layer 232 ispresent over the N+ region 214 for the collector contact, and a silicidelayer 234 is present over the emitter 220 for the emitter contact. Asillustrated, a base contact 236 for example makes contact with thesilicide layer 228 on one side of the emitter stack 221, an emittercontact 238 for example makes contact with the silicide 234 over theemitter, and a collector contact 240 for example makes contact with thesilicide 232 over the N+ region 214.

The height, indicated by an arrow 242 in FIG. 2, of the top of theemitter stack 221 from the surface 213 of silicon substrate, for examplemeasured from the planarized top surface of the STI 204, is for examplebetween 50 and 70 nm. The contact height, from the top of the emitterstack, is for example of between 150 and 200 nm. This leads to anoverall height, indicated by the arrow 244 in FIG. 2, of the deviceincluding the contacts 236, 238 and 240 of between 200 and 250 nm. Suchan overall height is possible due to the buried base 216, which forexample does not extend higher than the surface 213 of the substrate202. The base 216 is for example of around 50 nm in thickness, and sucha base formed above the surface of the substrate would generally lead toa total height of the device above the substrate 202 of more than 250nm, and generally of 300 nm or more.

A method of forming the heterojunction bipolar transistor of FIG. 2,alongside a MOS transistor, will now be described with reference to thecross-section views of FIGS. 3A to 3I. In the example of FIGS. 3A to 3I,the MOS transistor is an n-channel MOS (NMOS) transistor, but it will beapparent to those skilled in the art how the process could be adapted toform one or more p-channel MOS transistors in addition or instead of oneor more NMOS transistors. Furthermore, the process described results inthe formation of an NPN bipolar transistor, but it will be apparent tothose skilled in the art how the process could be adapted to theformation of a PNP bipolar transistor.

FIG. 3A is a cross-section view of a semi-conductor device part waythrough fabrication, comprising a semi-conductor substrate 202, forexample formed of silicon. The STIs 204, 206 and 208 of FIG. 2 arealready present, along with a further STI 302. Each of the STIs 204, 206and 302 is for example between 150 and 300 nm in width at its widestpoint, while the STI 208 is for example between 100 and 150 nm in widthat its widest point. In the embodiment of FIG. 3A, each of the STIs 204to 208 and 302 has the same depth, for example of between 150 and 300 nmfrom the surface 213 of the silicon substrate, although in alternativeembodiments, as described above, STI 208 could be less deep than theother STIs.

Successive layers 304 to 310 are formed over the substrate 202, coveringthe STIs. As will become apparent herein after, these layers form thegate stack of one or more MOS transistors. The layers comprise, in orderstarting from the surface of the substrate 202: a layer 304 of adielectric material, for example of SiON, formed over the substrate 202,and for example having a thickness of between 2 and 10 nm; a layer 306of a further dielectric material, for example of HfSiON, and for examplehaving a thickness of between 1 and 3 nm; a layer 308 of a metal, forexample lanthanum and for example having a thickness of between 1 and 3nm; a layer 310 of TiN, for example having a thickness of between 5 and10 nm; and a layer 312 of amorphous silicon aSi for example having athickness of between 10 and 50 nm. It will be apparent to those skilledin the art that the above layers are merely examples, and that thenumber of layers and material used for each layer could be varieddepending on the desired characteristics of the MOS transistors.

FIG. 3B illustrates a subsequent step in which a hard mask layer 314 andthen a photolithography resist layer 316 are deposited over theamorphous silicon layer 312. A photolithography operation is then usedto etch an opening 318 through the layers 306 to 316, stopping at thedielectric layer 304, which is for example an oxide such as SiON. Thearea of opening 318 corresponds to an area in which the bipolartransistor is to be formed, and for example extends between the STIs 204and 206. Furthermore, the etched area 318 for example overlaps the topsurface of the STIs 204 and 206 on each side.

A collector implantation step is then performed in the opening 318 toform the buried collector region 212. For example, an implantation ofarsenic is used to form an n-type collector. The resulting buriedcollector region 212 for example has a top surface at between 20 and 80nm below the surface 213 of the silicon structure, and for exampleextends to a depth of between 200 and 300 nm.

FIG. 3C illustrates a subsequent step in which a hard mask is deposited,for example comprising an oxide layer 322 covered by a nitride layer324. In alternative embodiments, a thicker layer of oxide could be usedto provide an oxide only hard mask. A photolithography step is used toopen the hard mask in a region 326, between the STIs 204 and 208, andfor example partially exposing the top surface of these STIs on eachside.

A further etching operation is then performed to make a recess 328between the STIs 204 and 208. For example, the bottom of the recess 328,shown by a line 325 in FIG. 3C, is between 50 and 70 nm below thesurface 213 of the silicon substrate. The etchant is for example HCl.

The depth of the recess is for example chosen such that a layer 327 ofp-type substrate material remains at the bottom of the recess 328,covering the collector 212. This layer 327 for example has a thicknessof between 10 and 30 nm. This layer 327 defines the base-collectorjunction. In alternative embodiments, for example to achieve a highcollector doping at the base-collector junction, the recess 328 couldextend into the collector 212. For example, the bottom 325 of the recesscould be at a greater depth below the surface 213 of the siliconsubstrate 202, and/or the top of the collector 212 could be less deep.

FIG. 3D illustrates a subsequent step in which selective epitaxialgrowth (SEG) is for example used to form the at least partially buriedbase 216 of the HBT. For example, the epitaxial layer selectively growson the silicon at the bottom of recess 328, and not on the dielectricsurfaces, such as the STIs 204, 208 and hard mask 324. Alternatively,the epitaxial layer selectively grows at a faster rate on the siliconlayer at the bottom of the recess 328 than on the dielectric layers, andetching, for example using HCl, is performed to remove the growth on thedielectric layers. In either case, the conditions for achieving such anepitaxial growth, such as the gas flow rates and temperature, are wellknown to those skilled in the art.

In some embodiments, the epitaxial base 216 is formed of an SiGeC film,which is then for example doped with boron. In alternative embodiments,it would be possible to form other types of epitaxial silicon filmsforming the base, such as for example a doped Si or SiGe film.Furthermore, in some embodiments, the base 216 can comprise a siliconcapping, and the density of germanium in the base could be graded.

In some embodiments, the thickness of film forming the base 216 is lessthan or equal to the depth of recess 328 below the surface 213 of thesubstrate 202. Thus the top surface of the base 216 is below or flushwith the surface 213 of the substrate 202. In alternative embodiments,the film forming the base 216 could extend to a level higher than thesurface of the substrate 202, in other words passing the top surfaces ofthe STIs 204 and 208 on each side, such that it is only partiallyburied.

Optionally, after formation of the base 216, an additional collectorimplantation step may also be performed at this stage, to implant aportion of the collector 212 directly under the base 216.

FIG. 3E illustrates a subsequent step in which a further hard mask isdeposited over the device, for example comprising an oxide layer 330 anda nitride layer 332. A photolithography operation is then performed toopen the hard mask in region 334 in a region of the base 216. The widthof region 334 is for example between 40 and 75 nm, and defines theemitter finger width.

A silicon layer 335 is then for example deposited over the device, andis for example doped in-situ to be of n-type, for example with arsenic.The silicon layer 335 for example has a thickness of between 50 and 100nm, or in the case that the top of the base 216 is flush with thesurface 213 of the silicon substrate 202, of between 50 and 70 nm. Aresin layer 336 is for example then deposited over layer 335.

FIG. 3F illustrates a subsequent step in which a photolithography stepis used to pattern the resin and define the emitter 220 of the HBT,formed of the doped silicon material of layer 335. The etching forexample stops at the oxide layer 330. The width of the emitter is forexample wider than the width of region 334, and thus portions 219A and219B of the nitride layer 332 for example remain in the emitter stack,one on each side of the opening 334.

An implantation passing through the oxide layer 330 is then for exampleperformed in order to form the extrinsic base 226 in top regions of thebase 216 on each side of the emitter 220. The extrinsic base 226 forexample has a thickness of between 20 and 40 nm, and is for example aheavily doped P+ region in the case that the HBT is an NPN bipolartransistor. The collector is for example protected from implantation bythe nitride layer 324, and the emitter 220 is protected by the resinlayer 336.

FIG. 3G illustrates a subsequent step in which the resin has beenstripped and the oxide and nitride layers 322, 324 and 330 have forexample been removed by a wet etch. The hard mask layer 314 has alsobeen removed.

A further hard mask layer 337 is then deposited, and a photolithographystep is used form the gate stack of the MOS transistor on the right handside of the structure. In particular, regions 338 and 339 are etched oneach side of a region 340 in which the gate stack is formed of portions304A to 312A of the layers 304 to 312. The gate stack is for exampleequal distance from the STIs 206 and 302. The region 336 for exampleextends to the STI 206.

FIG. 3H illustrates a subsequent step in which the hard mask 337 isremoved, and spacers are formed on each side of the MOS gate stack andof the emitter stack. For example, two layers of spacers are formed. Inparticular, spacers 222 are formed on the each side of the emitter stackand on each side of the MOS gate stack, and then further spacers 224form a second layer over each of the spacers 222. The spacers 222 and224 are for example formed of different oxides.

Source/drain regions are then for example implanted using a further mask(not illustrated in FIG. 3I), which for example not only forms heavilydoped n-type source/drain regions 341 and 342 each side of the spacersof the MOS gate stack 343, but also penetrates the substrate between theSTIs 208 and 206, to form the heavily doped n-type region 242 used toelectrically connect the collector 212. Furthermore, while notillustrated in the figures, a further collector implantation operationcould be performed at this stage using a further mask, for example toreduce the resistance in the collector and improve dynamic performanceof the HBT.

A source/drain activation anneal of the MOS transistor for exampleresults in the doping species in the emitter 220 being driven into anadjacent zone of the base 216, as labeled 218 in FIG. 3H.

The metal silicides 228, 230 and 234 for the contacts of the HBT, andsilicides 344, 346 and 348 respectively for the source/drain and gatecontacts of the MOS transistor are then for example formed by depositinga metal, such as Ni or Ti, and performing an anneal.

FIG. 3I illustrates yet a further step in which the contacts 236, 238and 240 respectively contacting the base, emitter and collectorsilicides 228, 234 and 232 of the HBT are formed, as well as contacts350, 352 and 354 respectively contacting the silicides 344, 346 and 348of the source/drain and gate of the MOS transistor.

Thus, advantageously, a method has been described of forming aheterojunction bipolar transistor having not only a buried collector,but also an at least partially buried base. This is achieved by etchingback the silicon substrate where the base is to be formed, prior toforming the base by epitaxial growth of a film comprising SiGe. Thisadvantageously leads to a reduction in the overall height of the HBTdevice. Furthermore, the method involves relatively few additional masksas compared to a CMOS process, meaning that the HBT is formed at arelatively low cost.

While a number of embodiments of the present disclosure have beendescribed, it will be apparent to those skilled in the art that thereare numerous further modifications and variations that could be applied.

For example, it will be apparent to those skilled in the art that theorder of certain steps in the process may be changed, for example of theimplantation steps, and that one or more additional steps could beperformed during the process.

Furthermore, it will be apparent to those skilled in the art that thevarious dimensions are provided in the present disclosure by way ofexample only, and that the dimensions can be adapted depending on devicecharacteristics to be achieved.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

1. A method, comprising: forming a heterojunction bipolar transistor,the forming of the bipolar transistor including: forming in a siliconsubstrate a first isolation trench and a second isolation trenchseparated from each other; forming a third isolation trench, the secondisolation trench being between the first isolation trench and the thirdisolation trench; forming a buried collector in the substrate extendingbetween the first isolation trench and the third isolation trench;forming a collector contact between the second isolation and the thirdisolation trench; forming a recess in the substrate between the firstisolation trench and the second isolation trench; and forming a base byepitaxially growing a film that includes silicon germanium in therecess.
 2. The method of claim 1 wherein a bottom of said recess isbetween 20 and 80 nm below of a surface of said silicon substrate. 3.The method of claim 1 wherein a bottom of said recess is between 50 and70 nm below of a surface of said silicon substrate.
 4. The method ofclaim 1 wherein forming said base comprises selectively growing saidfilm in said recess up to a level lower than or flush with a surface ofthe silicon substrate.
 5. The method of claim 1, further comprisingforming an emitter of said bipolar transistor by depositing an emittermaterial in over said base between the first isolation trench and thesecond isolation trench.
 6. The method of claim 1, further comprising,prior to forming said base: depositing one or more layers over saidsilicon substrate; and etching an opening in said one or more layers toexpose said substrate between said first and second isolation trenches,wherein said opening partially exposes a top surface of each of saidfirst and second isolation trenches.
 7. The method of claim 6 whereinsaid second isolation trench is less deep than said first and thirdisolation trenches.
 8. The method of claim 6, further comprising forminga gate stack of a MOS transistor by patterning and removing portions ofthe one or more layers.
 9. The method of claim 1 wherein a top surfaceof the first isolation trench, a top surface of the second isolationtrench, and a top surface of the base are coplanar with a top surface ofthe substrate.
 10. A heterojunction bipolar transistor, comprising: asubstrate having a top surface; first, second, and third isolationtrenches in the substrate, the second isolation trench being between thefirst and third isolation trenches; a buried collector in the substrateextending between the first isolation trench and the third isolationtrench; a collector contact between the second isolation and the thirdisolation trench; a recess in the substrate between the first isolationtrench and the second isolation trench; and a base region formed in therecess below the top surface of the substrate between first and secondisolation trenches, the base region including silicon germanium.
 11. Thetransistor of claim 10 wherein said recess is between 20 and 80 nm indepth.
 12. The transistor of claim 10 wherein said recess is between 50and 70 nm in depth.
 13. The transistor of claim 10, further comprisingan emitter formed directly over said base.
 14. A device, comprising: asubstrate having a top surface; a first isolation trench formed in thesubstrate; a second isolation trench formed in the substrate; a thirdisolation trench formed in the substrate, the second isolation trenchbetween the first isolation trench and the third isolation trench; aburied collector formed below the base, the buried collector extendingfrom the first isolation trench to the third isolation trench; acollector contact formed between the second isolation trench and thethird isolation trench; and a base formed between the first isolationtrench and the second isolation trench, the base being below the topsurface of the substrate, a top surface of the first isolation trench, atop surface of the second isolation trench, and a top surface of thebase are coplanar with the top surface of the substrate.
 15. The deviceof claim 14, further comprising: an emitter stack formed on the topsurface of the substrate above the base; and a base contact formedbetween the emitter stack and the first isolation trench.
 16. The deviceof claim 15, further comprising a MOS transistor formed on the substratespaced from the emitter stack by the second isolation trench and thethird isolation trench.
 17. A method, comprising: forming a first,second, and third isolation trench in a substrate, the second isolationtrench being between the first and the third isolation trench; forming aplurality of layers for a gate stack of a MOS transistor; forming anopening through the gate stack; forming a buried collector of a bipolartransistor in the substrate through the opening; forming a recess in thesubstrate between the first and the second isolation trench; forming abase of the bipolar transistor in the recess; forming an emitter stackabove the base between the first and the second isolation trench;forming the gate stack of the MOS transistor by removing excess portionsof the plurality of layers, the gate stack being separated from theemitter stack by the second and the third isolation trench.
 18. Themethod of claim 17 wherein forming the gate stack includes: formingdielectric layer; forming a conductive layer; and forming an amorphoussilicon layer.
 19. The method of claim 17 wherein a top surface of thesubstrate is coplanar with a top surface of the first isolation trench,a top surface of the second isolation trench, and a top surface of thebase.
 20. The method of claim 17 wherein a height of the emitter stackstarting from a top surface of the substrate is substantially the sameas a height of the gate stack starting from a top surface of thesubstrate.
 21. The method of claim 1 wherein the forming of the buriedcollector includes depositing a layer over the silicon substrate andforming an opening in the layer, the opening extending between the firstand third isolation trenches.
 22. The device of claim 15 wherein thesecond isolation trench has a depth that is less than a depth of thefirst isolation trench, the second isolation trench configured toisolate the base region from the collector contact.